Integration Method for Electronics in Woven Textiles

PROJECT TITLE :

Integration Method for Electronics in Woven Textiles

ABSTRACT:

This paper presents a technology to integrate electronics at the thread level in woven textiles. Flexible plastic substrates are cut into stripes and function carriers for electronics, including ICs, thin-film devices, interconnect lines, and get in touch with pads. These functionalized plastic stripes, called e-stripes, are woven into textiles. Conductive threads perpendicular to the e-stripes electrically interconnect the devices on the individual e-stripes. The combination of e-stripes and conductive threads into the woven textiles is compatible with industrial weaving processes and appropriate for large-scale producing. We tend to demonstrate the technology with a woven textile containing 5 e-stripes with digital temperature sensors. Conductive threads interconnect the e-stripes among each alternative to create a bus topology. We have a tendency to show that the contacts between the conductive threads and the pads on e-stripes likewise as the contacts between the temperature sensors and e-stripes stand up to shear forces of at least 20 N. The integration of the temperature sensors into the textile will increase the bending rigidity of the textile by thirtyp.c; but, it's still doable to get a textile-bending radii of $<rm 1~rm mm$. This technology seamlessly integrates electronics into textiles, so advancing the sphere of good textiles and wearable computing.

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