Substrate-Integrated Waveguide Vertical Interconnects for 3-D Integrated Circuits

PROJECT TITLE :

Substrate-Integrated Waveguide Vertical Interconnects for 3-D Integrated Circuits

ABSTRACT:

This paper presents and demonstrates a category of three-D integration platforms of substrate-integrated waveguide (SIW). The proposed right angle E-plane corner primarily based on SIW technology enables the implementation of varied three-D architectures of planar circuits with the printed circuit board and other similar processes. This design scheme brings up enticing blessings in terms of cost, flexibility, and integration. 2 circuit prototypes with both zero- and forty five$^circ$ vertical rotated arms are demonstrated. The straight version of the prototypes shows 0.five dB of insertion loss from thirty to forty GHz, while the rotated version provides zero.7 dB over the same frequency vary. With this H-to-E-plane interconnect, a T-junction is studied and designed. Simulated results show twenty-dB return loss over 19.25p.c of bandwidth. Measured results recommend an glorious performance inside the experimental frequency range of thirty two–37.4 GHz, with ten-dB come back loss and but $pm4^circ$ part imbalance. An optimized wideband magic-T structure is demonstrated and fabricated. Both simulated and measured results show a very promising performance with very good isolation and power equality. With two 45$^circ$ vertical rotated arm bends, two antennas are used to create up a dual polarization system. An isolation of 20 dB is shown over thirty two–forty GHz and therefore the radiation patterns of the antenna also are given.

Did you like this research project?

To get this research project Guidelines, Training and Code... Click Here