A Low-Cost TSV Test and Diagnosis Scheme Based on Binary Search Method


Testing through-silicon-vias (TSVs) is challenging largely because of the dimension gap between the TSVs and the probe needles. This paper proposes a coffee-value and efficient take a look at and diagnosis theme while not further style for take a look at structure or special probe technologies. A check probe head with current technology is in use, contacting multiple TSVs simultaneously. We tend to propose an efficient binary search-based algorithm to guide the probe card movement and diagnose the faulty TSVs. To judge the check efficiency, mathematical analyses are performed considering geometric, probabilistic, and electronic issues as well as method variations and different probe architectures. The analysis demonstrates that the take a look at potency can be largely enhanced by choosing applicable sizes of probe needles, and by adjusting iteration algorithms in keeping with the distribution of faulty TSVs.

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