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Reversible bonding by dimethyl-methylphenylmethoxy siloxane – based stamping technique for reusable poly(dimethylsiloxane) microfluidic chip

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PROJECT TITLE :

Reversible bonding by dimethyl-methylphenylmethoxy siloxane – based stamping technique for reusable poly(dimethylsiloxane) microfluidic chip

ABSTRACT:

Reversible packaging is very desirable for microfluidic chips: it allows changing the chip upper cap when it's damaged, cleaning and reusing the chip bottom substrate. This latter case becomes even more enticing when integrated parts are gift on the substrate and have needed a advanced and expensive microfabrication process. The feasibility of poly(dimethylsiloxane) (PDMS)/PDMS and PDMS/glass reversible bonding is demonstrated using the stamping technique. Dimethyl-methylphenylmethoxy siloxane (DMPMS), a type of silicone conformal coating, is used as an adhesive layer between the PDMS channel and the substrate (PDMS or glass). This method is straightforward to perform as it only wants spin-coating and thermal curing steps. The bond strength is suitable for prime working flow rate/pressure of liquid within the channel (up to five hundred μl/min and 200 kPa). The cycle 'pealing/bonding’ of the cap can be repeated up to 5 times. In addition, an MTT cell proliferation assay has been performed and suggests the non-cytotoxicity of DMPMS. So, the DMPMS-stamping bonding technique opens new views for PDMS biochips where plasma treatment isn't potential such as functionalised surfaces.


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Reversible bonding by dimethyl-methylphenylmethoxy siloxane – based stamping technique for reusable poly(dimethylsiloxane) microfluidic chip - 4.8 out of 5 based on 83 votes

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