Stereo Vision Based Automated Solder Ball Height and Substrate Coplanarity Inspection PROJECT TITLE :Stereo Vision Based Automated Solder Ball Height and Substrate Coplanarity InspectionABSTRACT:Solder ball height and substrate coplanarity inspection is crucial to the detection of potential connectivity problems in semi-conductor units. Current ball height and substrate coplanarity inspection tools such as laser profiling, fringe projection, and confocal microscopy are expensive, require sophisticated setup and are slow, that makes them difficult to use in a very real-time manufacturing setting. Therefore, a reliable, in-line ball height and substrate coplanarity measurement method is needed for inspecting units undergoing assembly. Did you like this research project? To get this research project Guidelines, Training and Code... Click Here facebook twitter google+ linkedin stumble pinterest Selective gray-coded bit-plane based low-complexity motion estimation and its hardware architecture Multistatic micro-doppler radar for determining target orientation and activity classification