Measurement Methodology for Field-Coupled Soft Errors Induced By Electrostatic Discharge PROJECT TITLE :Measurement Methodology for Field-Coupled Soft Errors Induced By Electrostatic DischargeABSTRACT:High-speed low-power mobile devices are sensitive to electrostatic discharge (ESD)-induced soft errors, like unwanted reset, lock up, loss of user interface, disturbed displays, etc. ESD will couple via current and fields into the inner cabling, printed circuit board traces but additionally directly into the integrated circuits (ICs). Many portable devices protect nearly all traces using top and bottom layer ground planes, and they apply effective filters at cable entry points such that direct field coupling to the IC can dominate the system's ESD sensitivity. However, a little data is out there on the robustness of ICs against direct ESD transient field coupling. A methodology for determining this robustness was developed and applied to a collection of client electronic ICs to create an initial robustness database. Custom-created electric and magnetic field probes are driven by a 400-ps rise time transmission line pulser to evaluate 37 different ICs. The investigation showed that 50% of the ICs were disturbed at approximately 33 kV/m for the electrical field injection and 142 A/m for the magnetic field injection at this rise time. This methodology will serve as the premise for any investigations of ICs. The database can be used to estimate the chance of field-coupled ESD-induced soft errors in electronic merchandise. Did you like this research project? To get this research project Guidelines, Training and Code... Click Here facebook twitter google+ linkedin stumble pinterest Opportunistic and Context-Aware Affect Sensing on Smartphones Analytical Surface Potential and Drain Current Models of Dual-Metal-Gate Double-Gate Tunnel-FETs
