PROJECT TITLE :
A Survey of Emerging Interconnects for On-Chip Efficient Multicast and Broadcast in Many-Cores
Networks-on-chip (NoC) have emerged to tackle different on-chip communication challenges and will satisfy different demands in terms of performance, price and reliability. Currently, interconnects primarily based on metal are reaching performance limits given relentless technology scaling. In explicit, a performance bottleneck has emerged due to the stress for communication in terms of bandwidth for multicasting and broadcasting. As a result, various state-of-the-art architectures are proposed as alternatives and emerging interconnects as well as the use of optics or radio frequency (RF). This article presents a comprehensive survey of these varied interconnect fabrics, and discusses their current and future potentials and obstacles additionally. This text aims to drive the analysis community to realize a higher utilization of the deserves of on-chip interconnects and addresses the challenges involved. New interconnect technologies, like optical interconnect, wireless NoC (WiNoC), RF transmission lines (RF-I) and surface wave interconnects (SWI), are mentioned, evaluated and compared. Consequently, these emerging interconnects will continue to provide the price potency and performance that are highly demanded for future many-core processors and high performance computing.
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