PROJECT TITLE :

High-Conductivity Adhesive for Light-Emitting Diode Die-Attachment by Low-Temperature Sintering of Micrometer-Sized Ag Particles

ABSTRACT:

A paste composed of micrometer-sized Ag particles and an organic solvent formed a soft porous bonding layer under atmospheric conditions at two hundred$^circrm C$ and above. Using this Ag paste for die-bonding of a lightweight-emitting diode (LED) resulted in glorious thermal resistance and reliability. Ag/Ag interactions are regarded as accountable for internal bonding, and the Ag paste will not bond strongly to different materials. To ameliorate this, polymer particles were added to the Ag paste. The flow beginning temperature of the polymer did not hinder the sintering of Ag particles, and the melted polymer particles served as an adhesive. The polymer-containing Ag paste had a lower specific resistance than that of the conventional conductive adhesives, therefore could be treated using low-temperature processes. The presence of polymer improved the die-shearing strength throughout the bonding of LED die to the plastic substrate.