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  4. Effect of Surface Roughness on Paper Substrate Circuit Board
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Category: Components, Packaging and Manufacturing Technology Projects
By MTech Projects
MTech Projects
21.Sep
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Effect of Surface Roughness on Paper Substrate Circuit Board

PROJECT TITLE :

Effect of Surface Roughness on Paper Substrate Circuit Board

ABSTRACT:

The European Union (EU) implemented the waste electrical and electronic equipment (WEEE) and restriction of hazardous substances (RoHS) directives in July 2006. To fulfil the environmental ethos of those EU directives, a printed circuit board (PCB) was developed based mostly on a currently mass-manufactured board, but employing a substrate of paper card, with interconnecting tracks added using conductive ink via a printing process. Parts were bonded to the tracks using electrically conductive adhesives via an trade-primarily based manufacturing line. During this investigation, paper card substrates of varying surface roughness were examined to establish the impact of substrate surface roughness for printing an interconnecting pattern for single-sided boards. Four degradable card substrate types with surface roughness values varying from 0.twenty five to a pair of.66 $murm m$ were trialled. The impact of substrate surface roughness heading in the right direction resistance was investigated and a correlation between increased substrate roughness and a reduction in track resistance was established, a discount in track resistance of up to 56percent was observed. Flammability analysis of the substrates was performed in accordance with BS61189-2, whereas mechanical, electrical, and functional tests were undertaken inline with international standards. The developed PCBs were deemed to possess met this established criteria, thus gap the likelihood of producing a WEEE/RoHS-compliant atmosphere-friendly PCB.

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