Transient evolution of mechanical and electrical effects in microelectromechanical switches subjected to long-term stresses PROJECT TITLE :Transient evolution of mechanical and electrical effects in microelectromechanical switches subjected to long-term stressesABSTRACT:Application of two totally different biasing waveforms in long-term stresses in RF MEMS switches is used to separate mechanical and electrical effects. Three different effects are shown: one) permanent mechanical degradation (creep result) after the primary stress and relaxation period; two) transient mechanical degradation (viscoelastic recoverable mechanism); and 3) transient electrical degradation (recoverable charge trapping). Such effects are extracted by monitoring the evolution of the actuation and release voltages in several RF MEMS switches subjected to dc biasing and recovery tests. This paper highlights the mechanical and the electrical degradation components in long-term stress tests with the aim of quantifying the weights of the various contributions. Did you like this research project? To get this research project Guidelines, Training and Code... Click Here facebook twitter google+ linkedin stumble pinterest Built-in Self-Calibration and Digital-Trim Technique for 14-Bit SAR ADCs Achieving ±1 LSB INL Sequential Lateral Solidification of Silicon Thin Films on Cu BEOL-Integrated Wafers for Monolithic 3-D Integration