PROJECT TITLE :

Approaching Roll-to-Roll Fluidic Self-Assembly: Relevant Parameters, Machine Design, and Applications

ABSTRACT:

This paper presents the implementation of an automated roll-to-roll fluidic self-assembly system based on the surface tension driven self-assembly with applications in the sphere of macroelectronics. The reported system incorporates automated agitation, web motion, element dispensing, and recycling. The process permits the assembly and electrical affiliation of semiconductor dies/chips during a continuous and parallel fashion over wide space substrates. At present, the method achieves an assembly rate of fifteen 000 chips per hour and an assembly yield exceeding 99%, testing assembly of commonplace square-formed dies, 300–one thousand $mu textm$ size. Scaling the system to any desired throughput is attainable thanks to the parallel manner of self-assembly. The identification and also the modeling of the relationship between method parameters and forces have been studied and experimentally verified by testing the result of the internet angle, agitation on assembly, and detachment rates. As an application, we tend to demonstrate the conclusion of a solid-state lighting module. This explicit application requires the assembly of a conductive multilayer sandwich structure, which is achieved by combining the introduced assembly process with a novel lamination step. [2015-0105]