Real-Time Device-Level Transient Electrothermal Model for Modular Multilevel Converter on FPGA


Real-time simulation of modular multilevel converters (MMCs) is challenging because of their complex structure consisting of a giant number of submodules (SMs). In the literature, the computational speed is emphasised for MMC modeling in real-time simulation, while correct and detailed information of insulated-gate bipolar transistor (IGBT) modules in SMs is sacrificed. A unique datasheet-primarily based device-level electrothermal model for an MMC on the sector programmable gate array (FPGA) is presented during this paper for real-time hardware emulation. Conduction and switching power losses, junction temperatures, temperature-dependent electrical parameters, and linearized switching transient waveforms of IGBT modules are adequately captured in the proposed model. Simultaneously the system-level behavior of the MMC is accurately modeled. 5-level and 9-level MMC systems are emulated in the hardware with the time step of ten μs and ten ns for system-level and device-level computations, respectively. The paralleled and pipelined hardware style using IEEE 32-bit floating purpose range precision runs on Xilinx Virtex-seven XC7VX485T device. The emulated real-time results by an oscilloscope have been validated by offline simulation on SaberRD software.

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