PROJECT TITLE :
Preliminary Evaluation of Thermo-Sensitive Electrical Parameters Based on the Forward Voltage for Online Chip Temperature Measurements of IGBT Devices
The temperature of power semiconductor devices is one amongst the main problems affecting the performance, availability, and reliability of power converters. The chip temperature is mostly measured using thermosensitive electrical parameters (TSEPs). These parameters are well controlled for laboratory temperature measurements, where the facility devices aren't used beneath functional conditions. However, the utilization of TSEPs for chip temperature measurements in online conditions has yet to be demonstrated. This paper presents an experimental analysis of two new TSEPs based mostly on measuring the forward voltage, which could be used throughout operation of the converter. It examines the accuracy of the chip temperature measurement and additionally discusses the results in terms of robustness to the aging of power devices.
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