It is well recognized that power consumption and heat removal in state-of-the-art integrated circuits (ICs) with the nanometer size of transistors is an urgent challenge. The electronic industry's transition to multicore designs, where the performance increase is achieved not via the increase in the clock frequency but rather through the increase in the number of processors, helped to alleviate some of the thermal issues but has not solved the problem of the nonuniformity of heat distribution inside a computer chip.

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