PROJECT TITLE :
Modeling of Temperature Effects on Micromachined Silicon Thermal Wind Sensors
A 2-D micromachined silicon thermal wind sensor measures wind speed and direction by monitoring temperature variations induced by an airflow that passes along the substrate surface. When ambient temperature changes, but, the temperature drift of the sensor can cause incorrect output values. By examining the thermophysical properties of the airflow, substrate, and temperature sensitive component, this paper has developed a closed-form semi-empirical model to understand the physical origins of temperature drift in the 2-D micromachined silicon thermal wind sensor. Using the model, the temperature drift will easily be compensated by directly extracting two empirical parameters from the uncompensated sensor output. Experiments presented here show that the temperature compensated sensor is working well in an exceedingly temperature range between −twenty °C and 40 °C with the relative error being less than ±three.five%. [2015-0121]
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