PROJECT TITLE :

Epoxy/BN micro- and submicro-composites: dielectric and thermal properties of enhanced materials for high voltage insulation systems

ABSTRACT:

Hexagonal boron nitride (h-BN) could be a very promising material for application in high voltage insulation engineering due to its high thermal conductivity and good electrical insulating properties. In order to review the effect of incorporating BN particles in epoxy resin, composites with different filler sizes and many BN loadings are fabricated. Two completely different filler sizes, one micrometric with a median grain size of 9 μm and a submicrometric one with zero.5 μm, are used to make composites. The amount of either kind of BN in the matrix has been varied from 1 to five wt%. Dielectric and thermal performances of the take a look at specimens have been assessed by means that of Dielectric Spectroscopy, Differential Scanning Calorimetry, surface erosion, AC breakdown tests and thermal conductivity measurements. It has been found that incorporation of BN particles in the epoxy resin resulted in significant improvements of parameters such as resistance to electrical discharge, also diminished dielectric losses for the composites at higher temperatures. Furthermore, BN composites with five wt% filler loadings have shown a motivating enhancement of thermal conductivities, that was a lot of distinct for the submicrometric BN composite.