Development of an Ultralong Ultralow n-Loop for Wire Bonding PROJECT TITLE :Development of an Ultralong Ultralow n-Loop for Wire BondingABSTRACT:In this paper, we have a tendency to describe an innovative methodology to make an ultralong ultralow loop for wire bonding. A resister was used to form kinks and simplify the capillary trace, that yielded a loop-like “n”-shape with two kinks immediately on top of the first and second bonds which will support the whole long-span loop. A three-D finite part model was developed to simulate the n-loop formation, and therefore the loop profiles of an n-loop, M-loop, and normal loop were compared. In this paper, we show that this novel n-loop will nearly halve the looping time compared to that for the M-loop; and therefore the n-loop will avoid wire sag for a 500zero-μ m-long span. Furthermore, the loop height and wire verticality close to the second bond will be modified by regulating the horizontal and vertical positions of the resister. Did you like this research project? To get this research project Guidelines, Training and Code... Click Here facebook twitter google+ linkedin stumble pinterest A Level-Set Method for Skinning Animated Particle Data Phase Unwrapping in Spectral X-Ray Differential Phase-Contrast Imaging With an Energy-Resolving Photon-Counting Pixel Detector
