Swizzle-Switch Networks for Many-Core Systems PROJECT TITLE :Swizzle-Switch Networks for Many-Core SystemsABSTRACT: This work revisits the look of crossbar and high-radix interconnects in lightweight of advances in circuit and layout techniques that improve crossbar scalability, obviating the necessity for deep multi-stage networks. We tend to use a replacement building block, the Swizzle-Switch—an energy- and area-economical switching part that may readily scale to radix 64—that has recently been validated via silicon check chips in forty five nm technology. We evaluate the Swizzle-Switch as both the high-radix building block of a Flattened Butterfly and as a single-stage interconnect, the Swizzle-Switch Network. In the process we address the architectural and layout challenges associated with centralized crossbar systems. Compared to a typical Mesh, the Flattened Butterfly provides a 15percent performance improvement with a 2.five$times$ reduction in the standard deviation of on-chip access times. The Swizzle-Switch Network achieves further gains, providing a 21percent improvement in performance, a three$times$ reduction in on-chip access variability, a 33% reduction in interconnect power, and a 25p.c reduction in total system energy whereas solely increasing chip space by 7percent. Finally, this paper details a three-D integrated version of the Swizzle-Switch Network, showing up to a thirtyp.c gain in performance over the 2-D Swizzle-Switch Network for benchmarks sensitive to interconnect latency. One major concern with 3-D styles is thermal dissipation. We show through detailed thermal analysis that with the highly energy-economical Swizzle-Switch Network design that the thermal budget is well inside that of passive cooling solutions. Did you like this research project? To get this research project Guidelines, Training and Code... Click Here facebook twitter google+ linkedin stumble pinterest Energy-Effective Sub-Threshold Interconnect Design Using High-Boosting Predrivers Design Quality Trade-Off Studies for 3-D ICs Built With Sub-Micron TSVs and Future Devices