PROJECT TITLE :

Impact of Thermal Cycling in Humid Environments on Power Electronic Modules

ABSTRACT:

The reliable operation of power electronic modules operating at high voltage is essential. The dielectric system inside the facility electronic module is moderately straightforward, however should be worked as hard as doable to realize the best module power densities. It's well known that a important location in a power electronic module in terms of high voltage performance is the edge of the substrate metallization where high electrical fields can provide rise to partial discharge inside power electronic modules and will lead to eventual failure. This paper focuses on 2 particular problems. Initial, the performance of the gap between the substrate metallization on that the collector and emitter of the device sit is examined. Second, the performance of the substrate–gel interface is examined once samples are thermally aged in a humid environment.