Height Measurement of Micro-Solder Balls on Metal Pad by White Light Projection PROJECT TITLE :Height Measurement of Micro-Solder Balls on Metal Pad by White Light ProjectionABSTRACT: Micro-solder balls are commonly used in wafer-level ball grid array (BGA) packages as an interconnection medium. To live the height of a micro-solder ball on a metal pad, we tend to propose a white light projection methodology to avoid interference from pads in the shadow of the ball. The optical projection of a solder ball underneath the illumination of a parallel white light-weight beam is studied, and therefore the relationships between the ball height, ball radius, and shadow length are deduced. An experimental platform with a straightforward optical system and white light emitting diodes lighting supply is constructed to get ball and shadow pictures, and a program developed to process these pictures and calculate the ball height. The heights of the balls on a BGA chip are measured using this new methodology, and the results verified employing a industrial optical profiler. This method isn't sensitive to the patterns on the substrate surface and has nice potential for future application. Did you like this research project? To get this research project Guidelines, Training and Code... Click Here facebook twitter google+ linkedin stumble pinterest Compact Thermal Resistor-Capacitor-Network Approach to Predicting Transient Junction Temperatures of a Power Amplifier Module Tombstone Initiation Model for Small Form-Factor Surface Mount Passives
