PROJECT TITLE :

A Circuit to Eliminate Serial Skew in High-Speed Serial Communication Channels

ABSTRACT:

This temporary relates to communication established through high-speed serial links. A serial communication channel can be formed by grouping multiple high-speed serial communication lanes to achieve bigger serial bandwidth. Such channels require circuitry to eliminate relative skew across multiple lanes to confirm information integrity in the receiver. Channel bonding is a mechanism used to synchronize serial communication channels in larger data rate and bandwidth applications. This transient presents an approach to channel bonding that optimizes area, power, and initialization time and yields better performance. The concepts mentioned here use a delay-primarily based model and explore the chance of performing channel bonding in an exceedingly centralized means. The methodology is deployed in the Aurora Protocol Solution Suite, and a comparative analysis with another state-of-the-art approach is performed.