Through the Looking Glass?The 2015 Edition: Trends in Solid-State Circuits from ISSCC PROJECT TITLE:Through the Looking Glass?The 2015 Edition: Trends in Solid-State Circuits from ISSCCABSTRACT:The International Solid-State Circuits Conference (ISSCC) is that the flagship conference of the IEEE Solid-State Circuits Society. This year, for ISSCC, the theme is ?Silicon Systems: Tiny Chips for Huge Information.? Huge data is enveloping us: it's being generated by the Internet-of-Things (IoT), health care, and also the Web, changing our society and our individual lives. Little silicon chips enable these changes through information sensing, gathering, processing, storing, and NetWorking through wireless and wireline connectivity. Recent silicon-?system technologies, including ultra-low-Power Systems, high-performance circuits and systems, wireless power and data transmission, and 3-dimensional (three-D) IC structures, can open the door to Big Data applications. Moreover, massive knowledge applications like health care, Machine Learning, and sensor systems will challenge designers to consider new system architectures requiring advances in circuits and technology. ISSCC 2015 showcases novel circuit and system solutions that open new vistas for society, providing opportunities for brand spanking new lifestyle transformations, all driven by huge information technology. Did you like this research project? To get this research project Guidelines, Training and Code... Click Here facebook twitter google+ linkedin stumble pinterest Anatomy-Guided Dense Individualized and Common Connectivity-Based Cortical Landmarks (A-DICCCOL) Robomorphism: A Nonanthropomorphic Wearable Robot