3-D integration provides a pathway to achieve high performance microsystems through bonding and interconnection of best-of-breed materials and devices. Bonding of device layers can be accomplished by dielectric bonding and/or metal–metal interconnect bonding with a number of metal–metal systems currently under development. RTI has been investigating Cu–Cu and Cu/Sn–Cu interconnect processes for high density area array applications. The interconnect pad fabrication processes and the interconnect bonding conditions (pressure and temperature) required for the formation of low resistance (10's of ${rm m}Omega$), high yielding (${geq}{99.98}%$ bond yield), and reliable interconnects are described. The effects of thermal reliability testing (aging) on electrical connectivity and mechanical strength are presented. Results from the two metal–metal interconnect bonding systems are compared in terms of ease of assembly and small pitch (sub-15 $mu{rm m}$) scaling. Methods for obtaining high bond yield at smaller pitches are discussed.

Did you like this research project?

To get this research project Guidelines, Training and Code... Click Here

PROJECT TITLE : Deep Tone Mapping Operator for High Dynamic Range Images ABSTRACT: The need for a rapid tone mapping operator (TMO) capable of adapting to a wide range of high dynamic range (HDR) content on low dynamic range (LDR)
PROJECT TITLE : High Quality Bayesian Pansharpening ABSTRACT: Fusion of low-resolution multispectral images with high resolution panchromatic images is known as pansharpening, and the result is a multi-spectral image with high
PROJECT TITLE : A High Performance Shade-Tolerant MPPT Based on Current-Mode Control ABSTRACT: For photovoltaic (PV) applications, a high-performance shade-tolerant maximum power point tracking (STMPPT) technique is proposed.
PROJECT TITLE : High Frequency PCB Winding Transformer with Integrated Inductors for a Bi-directional Resonant Converter ABSTRACT: Unrelenting progress is being made toward high-power density, high-efficiency power converters.
PROJECT TITLE : Family of Multiport Switched-Capacitor Multilevel Inverters for High Frequency AC Power Distribution ABSTRACT: In order to distribute high-frequency ac power, this study offers a variety of SCMLI (switched-capacitor

Ready to Complete Your Academic MTech Project Work In Affordable Price ?

Project Enquiry