PROJECT TITLE :

Laser Micromachining and Characterization of Metal-on-Glass High Density Pitch Adapters

ABSTRACT:

Pitch adapters (PAs) are passive electronic parts widely used to adapt totally different pitches between silicon strip detectors and readout electronics. This paper presents an optimized method to fabricate high-density PAs using laser ablation of metal-on-glass layers. Minimum pitch sizes of forty μm for the pads and 25 μm for the conductive traces were achieved. The resolution of the strategy allowed the cutting of traces as narrow as 15 μm. Different prototypes and tiny production series are successfully manufactured and tested for electrical parameters, bondability, and metrology. Ageing tests were additionally performed to make sure long-term reliability. The production yield reached 80percent. Absolutely purposeful particle detectors for high-energy physics have been assembled using these PAs, characterized and tested with lasers and radioactive sources.


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