PROJECT TITLE :

Thin-Copper-Metal Interconnection Thermomigration Analysis in ESD Regime

ABSTRACT:

Technological scaling poses severe constraints on the planning of metal interconnections, significantly for ESD protection network routing in advanced good-power technologies. A detailed analysis of thin-interconnection failure mechanisms under high power pulses and their related root causes is mandatory. In this paper, this analysis is illustrated using characterizations, failure analyses, and 3-D TCAD physical simulations information.