Thin-Copper-Metal Interconnection Thermomigration Analysis in ESD Regime PROJECT TITLE :Thin-Copper-Metal Interconnection Thermomigration Analysis in ESD RegimeABSTRACT:Technological scaling poses severe constraints on the planning of metal interconnections, significantly for ESD protection network routing in advanced good-power technologies. A detailed analysis of thin-interconnection failure mechanisms under high power pulses and their related root causes is mandatory. In this paper, this analysis is illustrated using characterizations, failure analyses, and 3-D TCAD physical simulations information. Did you like this research project? To get this research project Guidelines, Training and Code... Click Here facebook twitter google+ linkedin stumble pinterest Incorporating Human Perception With the Motion Washout Filter Using Fuzzy Logic Control An Aggregate Model of Plug-In Electric Vehicles for Primary Frequency Control