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  4. Bimaterial Cantilever Focal Plane Array for Uncooled Infrared Imaging Using Sandwich-Framed Structure
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Category: Mechatronics
By MTech Projects
MTech Projects
15.May
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Bimaterial Cantilever Focal Plane Array for Uncooled Infrared Imaging Using Sandwich-Framed Structure

PROJECT TITLE :

Bimaterial Cantilever Focal Plane Array for Uncooled Infrared Imaging Using Sandwich-Framed Structure

ABSTRACT:

This paper reports a unique infrared focal plane array (FPA) using SiNx/SiO2/SiNx sandwiched structure because the supporting frames for bimaterial cantilever pixels. The device was fabricated by a bulk silicon method, where a trench backfill technique was employed to form the SiNx/SiO2/SiNx sandwiched frames. By replacing the silicon frame with SiNx/SiO2/SiNx sandwiched frame, the fill issue of the FPA is increased to forty twopercent. Compared with other substrate-free FPAs with frames making of a skinny layer of SiNx, the sandwiched frame provides a lot of supporting strength for the cantilever pixels. Meanwhile, the reliability and therefore the uniformity of the FPA were improved with a design of staggered arrangement of cantilever pixels. Thermal images of human bodies were captured successfully at space temperature. A complete analysis of device performance was also applied each theoretically and experimentally, including thermomechanical sensitivity, noise equivalent temperature distinction, and response time.

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