Room Temperature Si–Si Direct Bonding Technique Using Velcro-Like Surfaces PROJECT TITLE :Room Temperature Si–Si Direct Bonding Technique Using Velcro-Like SurfacesABSTRACT:Si surfaces were functionalized by anodization to create nanoneedles. Such surfaces allow Velcro-like bonding at room temperature with giant bond strength for such functionalized surfaces. As well, Velcro-like bonding encompasses a capability of multiple bonding and debonding of the identical surfaces analogous to the Velcro principle. To use such surfaces and therefore the bonding technique in wafer or chip bonding or in integrated circuit packaging applications, understanding the fabrication and also the bonding mechanism between such surfaces is terribly crucial. This paper presents a straightforward silicon-based technology to get Velcro-like surfaces using the anodization of Si wafer in an exceedingly hydrofluoric acid-primarily based electrolyte, and describes the bond strength between such surfaces using the van der Waals force approach. The aptitude of the technique and the validity of the proposed van der Waals force model are shown by comparison with the experimental results. Did you like this research project? To get this research project Guidelines, Training and Code... Click Here facebook twitter google+ linkedin stumble pinterest ZnO Nanotapered Arrays With Successively Modulated Sharpness Via a Supersaturation-Controlled Hydrothermal Reaction for Efficient Field Emitters High-Frequency Characteristics of the Axisymmetric TM Modes in a Coaxial Staggered Double-Grating Slow-Wave Structure
