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  4. Mechanical Interfacing Using Suspended Ultrathin Films From ALD
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Category: Industrial Electronics
By MTech Projects
MTech Projects
15.May
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Mechanical Interfacing Using Suspended Ultrathin Films From ALD

PROJECT TITLE :

Mechanical Interfacing Using Suspended Ultrathin Films From ALD

ABSTRACT:

Interlocking microstructures fashioned from suspended ultrathin films create a mechanical bond between heterogeneous microfabricated dies. Films approximately 34 nm in thickness are fabricated using atomic layer deposition together with normal surface micromachining. Bonding surfaces incorporates polyimide pillars with a pitch of 19.eight-29 μm that support nanofilm cantilevers, with an areal density of nine.fifty two × 103 joints/mm2 for sq. surface tiling and 4.14 × 103 joints/mm2 for triangle tiling. Cantilevers 2.two and three.1 μm in length offer length-to-thickness side ratios of 65:1 and 91:1, respectively. Bonding of complementary mating surfaces has been observed optically through transparent versatile substrates.

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