Editorial 2014 IEEE TSM Best Paper Award PROJECT TITLE :Editorial 2014 IEEE TSM Best Paper AwardABSTRACT:High quality scholarship needs technical excellence and additionally connects the work to the first references in the field. In this method, the reader advances their data and gains perspective. The IEEE TRANSACTIONS ON SEMICONDUCTOR PRODUCING (TSM) supports these goals by recognizing the most effective paper chosen by the Associate Editors and reviewers. The winning paper was selected from 59 papers revealed by the TSM in 2014. The winner is “Feasibility Analysis of Virtual Metrology for the Example of a Trench Etch Process” by Georg Roeder, Sirko Winzer, Martin Schellenberger, Stefan Jank, and Lothar Pfitzner published in the August 2014 issue of the IEEE TRANSACTIONS ON SEMICONDUCTOR PRODUCING (ten.1109/TSM.2014.2321192). Congratulations to the authors on being selected. Did you like this research project? To get this research project Guidelines, Training and Code... Click Here facebook twitter google+ linkedin stumble pinterest A New Chirp Scaling Algorithm for Highly Squinted Missile-Borne SAR Based on FrFT Robust active disturbance rejection controller design to improve low-voltage ride-through capability of doubly fed induction generator wind farms
