Formulation and Network Model Reduction for Analysis of the Power Distribution Network in a Production-Level Multilayered Printed Circuit Board PROJECT TITLE :Formulation and Network Model Reduction for Analysis of the Power Distribution Network in a Production-Level Multilayered Printed Circuit BoardABSTRACT:A methodology for modeling the facility delivery network from the voltage regulator module to the pins of a high pin count integrated circuit on a printed circuit board (PCB) is presented. The proposed model is predicated on inductance extraction from 1st principle formulation of a cavity fashioned by parallel metal planes. Circuit reduction is employed to practically realize the model for a production level, complicated, multilayer PCBs. The lumped component model is compatible with SPICE-type simulators. The resulting model has a comparatively easy circuit topology. The model is corroborated with microprobing measurements up to a few gigahertz. The model will be used for a wide range of geometry variations in an exceedingly power integrity analysis, together with complicated power/ground stack up, varied numbers of decoupling capacitors with arbitrary locations, various IC power pins and IC power/ground return via layouts, in addition to tons of ground come back vias. Did you like this research project? To get this research project Guidelines, Training and Code... Click Here facebook twitter google+ linkedin stumble pinterest Reliable Finite-Difference Time-Domain Simulations of Reverberation Chambers by Using Equivalent Volumetric Losses A Time-Domain Macromodel Based on the Frequency-Domain Moment Method for the Field-to-Wire Coupling
