Inherent point defects at the thermal higher-Miller index (211)Si/SiO2 interface

PROJECT TITLE :

Inherent point defects at the thermal higher-Miller index (211)Si/SiO2 interface

ABSTRACT:

Electron spin resonance (ESR) studies were carried out on the higher-Miller index (211)Si/SiO2 interface thermally grown in the temperature range Tox = 400–1066 °C to assess interface quality in terms of inherently incorporated point defects. This reveals the presence predominantly of two species of a Pb-type interface defect (interfacial Si dangling bond), which, based on pertinent ESR parameters, is typified as Pb0(211) variant, close to the Pb0 center observed in standard (100)Si/SiO2—known as utmost detrimental interface trap. Tox ≳ 750 °C is required to minimize the Pb0(211) defect density (∼4.2 × 1012 cm−2; optimized interface). The data clearly reflect the non-elemental nature of the (211)Si face as an average of (100) and (111) surfaces. It is found that in oxidizing (211)Si at Tox ≳ 750 °C, the optimum Si/SiO2 interface quality is retained for the two constituent low-index (100) and (111) faces separately, indicating firm anticipating power for higher-index Si/SiO2 interfaces in general. It implies that, as a whole, the quality of a thermal higher-index Si/SiO2 interface can never surmount that of the low-index (100)Si/SiO2 structure.

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