A Fully Integrated Oven Controlled Microelectromechanical Oscillator—Part II: Characterization and Measurement


This paper, the second of two elements, reports the measurement and characterization of a totally integrated oven controlled microelectromechanical oscillator (OCMO). The OCMO takes advantage of high thermal isolation and monolithic integration of each aluminum nitride (AlN) micromechanical resonators and electronic circuitry to thermally stabilize or ovenize all the elements that comprise an oscillator. Operation at microscale sizes permits implementation of high thermal resistance platform supports that enable thermal stabilization at very low-power levels when compared with the state-of-the-art oven controlled crystal oscillators. A prototype OCMO has been demonstrated with a measured temperature stability of −1.a pair of ppb/°C, over the commercial temperature range while using tens of milliwatts of provide power and with a volume of two.3 mm $^3$ (not as well as the printed circuit board-based thermal management loop). In addition, due to its little thermal time constant, the thermal compensation loop can maintain stability throughout fast thermal transients (>10 °C/min). This new technology has resulted in a very new paradigm in terms of power, size, and heat up time for high thermal stability oscillators. [2015-0036]

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