PROJECT TITLE :

Development of an Ultralong Ultralow n-Loop for Wire Bonding

ABSTRACT:

In this paper, we have a tendency to describe an innovative methodology to make an ultralong ultralow loop for wire bonding. A resister was used to form kinks and simplify the capillary trace, that yielded a loop-like “n”-shape with two kinks immediately on top of the first and second bonds which will support the whole long-span loop. A three-D finite part model was developed to simulate the n-loop formation, and therefore the loop profiles of an n-loop, M-loop, and normal loop were compared. In this paper, we show that this novel n-loop will nearly halve the looping time compared to that for the M-loop; and therefore the n-loop will avoid wire sag for a 500zero-μ m-long span. Furthermore, the loop height and wire verticality close to the second bond will be modified by regulating the horizontal and vertical positions of the resister.