PROJECT TITLE :

Closed-form and dispersive model considerations for relative permittivity extraction at millimetre-wave frequencies

ABSTRACT:

This study provides a easy broadband technique for determining the dielectric properties of laminate substrate materials used in integration and packaging solutions for industrial millimetre-wave applications. Relative permittivity and loss tangent are extracted from coplanar lines using closed-form equations that account for as-fabricated transmission line dimensions. The strategy is applied to a low loss substrate alumina and additional tested on glass impregnated epoxy resin materials with metals that have an appreciable metal surface roughness. The work expands existing material characterisation ways that are sometimes primarily based on skinny films. The dielectric substrates are skinny, like integrated circuits, however the metal thicknesses remain on the order of packaging substrates. This study considers the important parameters and producing options for styles and millimetre-wave material measurements on these types of materials. The tactic has an accuracy of within 10p.c of known values, utilises off-the-shelf software solutions when available, and needs no fixturing beyond the sample material. Error analysis is supplied with material information on Isola FR408 up to 110 GHz.