PROJECT TITLE :

Mushroom-Shaped Micropillars for Robust Nonwetting Surface by Electrohydrodynamic Structuring Technique

ABSTRACT:

Mushroom-formed micropillars (MSMPs) have a unique microscopic form that is suitable to produce a highly robust nonwetting surface. This commercially vital property is doable because of the precise overhang shape, which includes a larger tip diameter than the shaft below. We have a tendency to fabricated such a textured surface using poly(methyl methacrylate) (PMMA) via electrohydrodynamic structuring technique. The method combines hot embossing, electrically induced growth, and electrowetting. Even though PMMA itself is hydrophilic (the intrinsic contact angle is eighty two°), its modified surface is hydrophobic with a comprehensible contact angle of 152°. We tend to also studied the robustness of the nonwetting surface by comparing the distinction between the static contact angles before and when the samples had been submerged in water. Our results show that solely the surface structured with the 43-μm tip-diameter MSMPs (the biggest size) can successfully maintain its highly nonwetting property. Because of the large fabrication potential of the MSMPs with a giant tip diameter, the described surface structuring technique is a promising candidate for the mass production of artificial and sufficiently strong nonwetting surfaces.