PROJECT TITLE :

Nanostructured electrical insulating epoxy thermosets with high thermal conductivity, high thermal stability, high glass transition temperatures and excellent dielectric properties

ABSTRACT:

The necessity for improving performance of electronic devices and electrical equipment has forever resulted in new high-performance electrical insulating materials. One important issue is the need to use dielectric polymers with higher thermal conductivities. During this study, by forming ordered nanostructure in epoxy resin via introducing four, four'- dihydroxydiphenyl (DHDP), electrical insulating epoxy thermosets simultaneously having high thermal conductivity, high thermal stability, high glass transition temperatures and excellent dielectric properties were successfully prepared. The introduction of DHDP not solely will increase the rigidity of the modified epoxy chains but also leads to ordered nanostructure in the modified epoxy thermosets, that is considered as the most factor for the performance improvement of the modified epoxy thermosets.