Fast Random Walk Based Capacitance Extraction for the 3-D IC Structures With Cylindrical Inter-Tier-Vias PROJECT TITLE :Fast Random Walk Based Capacitance Extraction for the 3-D IC Structures With Cylindrical Inter-Tier-ViasABSTRACT:three-D integrated circuits (three-D ICs) build use of the vertical dimension for smaller footprint, higher speed, lower power consumption, and better timing performance. In three-D ICs, the inter-tier-via (ITV) could be a vital enabling technique as a result of it forms vertical signal and power paths. Accordingly, it's imperative to accurately and efficiently extract the electrostatic capacitances of ITVs using field solvers. Unfortunately, the cylindrical via shape presents major challenges to most of the prevailing methods. To address this issue, we have a tendency to develop a novel floating random walk (FRW) technique by rotating the transition cube to suit the cylindrical surface, devising a special space management technique, and proposing accelerating techniques for structures with giant-sized through-silicon-vias. Experiments on typical ITV structures counsel that the proposed techniques is up to lots times faster than a easy FRW approach and also the boundary element method-based algorithms, while not loss of accuracy. Also, compared with extracting the sq.-approximation structures, the proposed techniques will reduce the error by $ten times $ . Giant and multidielectric structures have conjointly been tested to demonstrate the flexibility of the proposed techniques. Did you like this research project? To get this research project Guidelines, Training and Code... Click Here facebook twitter google+ linkedin stumble pinterest Self-Tuning Mechanism for the Design of Adaptive Secondary Mirror Position Control Throughput/Area-efficient ECC Processor Using Montgomery Point Multiplication on FPGA
