Highly Reliable and Manufacturable Ultrafine Pitch Cu–Cu Interconnections for Chip-Last Embedding With Chip-First Benefits PROJECT TITLE :Highly Reliable and Manufacturable Ultrafine Pitch Cu–Cu Interconnections for Chip-Last Embedding With Chip-First BenefitsABSTRACT: Flip-chip packaging of Ultrafine pitch integrated circuits aggravates the strain–strain concerns as the interconnection pitch is decreased, requiring a basically totally different system approach to interconnections, underfill processes and interfaces, and therefore the substrate. This paper demonstrates an innovative and manufacturable answer to achieve excellent reliability at Ultrafine pitch $(simrm 30~murm m)$ using direct copper–copper (Cu–Cu) interconnections with adhesives. A number of 30-$murm m$ bump pitch check vehicles (TVs) were designed with 3 mm $times,$3 mm chips to extract each daisy chain resistance and single-bump resistance knowledge. Assembled bump resistivity was found to be $simrm 3hbox--4times$ below most solders. Performance of those TVs was studied for high temperature storage (HTS) life test, unbiased-highly accelerated stress check (U-HAST) and thermal cycling test (TCT). Test results showed that the assemblies with this next generation interconnection technology depicted excellent reliability results in HTS, U-HAST, and TCT tests. Based mostly on these results, it's concluded that adhesive materials, give distinctive opportunities for Ultrafine pitch and high performance interconnections. Did you like this research project? To get this research project Guidelines, Training and Code... Click Here facebook twitter google+ linkedin stumble pinterest Finite Element Modeling and Analysis of Surface Acoustic Wave Devices in CMOS Technology Fabrication of Electronic Packaging Grade Cu–W Materials by High-Temperature and High-Velocity Compaction
