PROJECT TITLE :
Fabrication of 3-D Silicon Microneedles Using a Single-Step DRIE Process
ABSTRACT:
Fabrication of 3-D microstructures is one among the foremost difficult aspects of silicon micromachining. During this paper, we have a tendency to present a novel microfabrication method using one single-step deep reactive ion etching process with gray-scale e-beam lithography mask that provides deeply etched (>350-μm deep) dual-angle 3-d microneedles with control over the height and shape of the structures. Moreover, we have a tendency to found that the form of the e-beam lithography patterns can confirm the general configuration and features of the final etched microneedles, and that the etching method parameters have the foremost impact on the microneedles' shape, like size and vertical base angle. Massive arrays of 20 × twenty microneedles with height uniformity of better than threep.c are fabricated.
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