Integration Method for Electronics in Woven Textiles PROJECT TITLE :Integration Method for Electronics in Woven TextilesABSTRACT: This paper presents a technology to integrate electronics at the thread level in woven textiles. Flexible plastic substrates are cut into stripes and function carriers for electronics, including ICs, thin-film devices, interconnect lines, and get in touch with pads. These functionalized plastic stripes, called e-stripes, are woven into textiles. Conductive threads perpendicular to the e-stripes electrically interconnect the devices on the individual e-stripes. The combination of e-stripes and conductive threads into the woven textiles is compatible with industrial weaving processes and appropriate for large-scale producing. We tend to demonstrate the technology with a woven textile containing 5 e-stripes with digital temperature sensors. Conductive threads interconnect the e-stripes among each alternative to create a bus topology. We have a tendency to show that the contacts between the conductive threads and the pads on e-stripes likewise as the contacts between the temperature sensors and e-stripes stand up to shear forces of at least 20 N. The integration of the temperature sensors into the textile will increase the bending rigidity of the textile by thirtyp.c; but, it's still doable to get a textile-bending radii of $<rm 1~rm mm$. This technology seamlessly integrates electronics into textiles, so advancing the sphere of good textiles and wearable computing. Did you like this research project? To get this research project Guidelines, Training and Code... Click Here facebook twitter google+ linkedin stumble pinterest Development of a 3-D Process Technology for Wafer-Level Packaging of MEMS Devices Substrate-Integrated Waveguide Vertical Interconnects for 3-D Integrated Circuits