Modeling and Design Optimization of Ultrathin Vapor Chambers for High Heat Flux Applications PROJECT TITLE :Modeling and Design Optimization of Ultrathin Vapor Chambers for High Heat Flux ApplicationsABSTRACT: Passive phase-modification thermal spreaders, such as vapor chambers are widely used to unfold the warmth from little-scale high-flux heat sources to larger areas. In this paper, a numerical model for ultrathin vapor chambers has been developed, that is appropriate for reliable prediction of the operation at high heat fluxes and tiny scales. The results of boiling in the wick structure on the thermal performance are modeled, and also the model predictions are compared with experiments on custom-fabricated vapor chamber devices. The working fluid for the vapor chamber is water and a condenser aspect temperature vary of 293 K-333 K is taken into account. The model predictions agree moderately well with experimental measurements and reveal the input parameters to that thermal resistance and vapor chamber capillary limit are most sensitive. The vapor space in the ultrathin devices offers vital thermal and flow resistances when the vapor core thickness is in the vary of 0.2 mm–0.four mm. The performance of a 1-mm-thick vapor chamber is optimized by learning the variation of thermal resistance and total flow pressure drop as functions of the wick and vapor core thicknesses. The wick thickness is varied from 0.05 to 0.25 mm. Based mostly on the minimization of a performance price function comprising the device thermal resistance and flow pressure drop, it's concluded that the thinnest wick structures (0.05 mm) are optimal for applications with heat fluxes below fifty $rm W/rm cm^2$, while a moderate wick thickness of zero.one mm performs best at higher heat flux inputs $(>rm 50~rm W/rm cm^2)$. Did you like this research project? To get this research project Guidelines, Training and Code... Click Here facebook twitter google+ linkedin stumble pinterest Tombstone Initiation Model for Small Form-Factor Surface Mount Passives Silicon Platform With Vertically Aligned Carbon Nanotubes for Enhancing Thermal Conduction in Hybrid Optoelectronic Integration