PROJECT TITLE :

Compact THz LTCC Receiver Module for 300 GHz Wireless Communications

ABSTRACT:

A compact, low-value, fully-integrated package answer has been developed for 300 GHz short-range Communication systems. Using low-temperature co-fired ceramic (LTCC) technology, an integrated reflector for the on-chip antenna and high-knowledge-rate signal interconnections including a flip-chip and via transition are embedded during a package. A reduced-size silicon lens antenna is placed during a package cavity along with a flip-chip bonded receiver IC with an on-chip antenna. The general size of the front-end receiver is solely , including the half dozen mm diameter silicon lens. This compact terahertz receiver, mounted on an analysis board, demonstrated wireless links with data rates up to 27Gb/s.


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