Silicon Micromachined Device Testing by Infrared Low-Coherence Reflectometry


With the development of silicon micromachining technologies, non-contact measurement techniques for in-depth non-harmful inspection of layered and microstructured samples are becoming increasingly relevant. In this paper, we tend to apply optical low-coherence reflectometry (OLCR) to detect the optical path between the interfaces of several silicon devices with characteristic distance in the range three–17 $mu textm$ . The implemented configuration relies on a fiberoptic Michelson interferometer that exploits infrared broadband radiation within the wavelength range of one.2–one.7 $mu textm$ , with coherence length shorter than two $mu textm$ , for performing spot tomographic measurements. OLCR enabled out-of-plane measurements on a MEMS linear accelerometer and in-plane measurements on vertical periodic silicon/air microstructures. The optical distance between hidden interfaces was found well in agreement with the design parameters. [2015-0108]

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