Assessment of Constitutive Properties of Solder Materials Used in Surface-Mount Devices for Harsh Environment Applications


To perform a thermomechanical simulation of surface-mount devices (SMD), relevant solder constitutive properties are required. This paper reviews some promising Pb and Pb-free solders that are candidates to harsh environment applications. It presents the discrepancy in their common mechanical properties reported within the literature. The mechanical take a look at systems, solder microstructure beneath take a look at, and therefore the take a look at conditions (temperature and strain rate) are among the foremost causes for the discrepancy. The utilization of such variations in the solder thermomechanical properties as input information for simulation studies could cause reliability prediction less meaningful. A novel and reliable check methodology to extract relevant solder properties for surface mount applications is presented during this paper. To fulfill the methodology requirements, lap shear tests with accurate management of the reflow profile and dimensionally accurate solder joint thickness want to be conducted to breed the SMD solder joint microstructures for determining solder joint properties for elastic, plastic, and creep model simulations. 2 case studies with high-Pb and Pb-free solders are presented. Time-freelance yield strength and ultimate tensile strength data obtained from our studies were found to be over the reported literature knowledge. This methodology will be extended for different solder material systems with any surface end plating materials.

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