PROJECT TITLE :
Significance of Adhesion-Reduced Bouncing in Dynamic Contacts of Ohmic RF MEMS Switches
This paper presents a mathematical Euler-Bernoulli beam-based mostly model that simulates the dynamic behavior of typical cantilever-type radio frequency microelectromechanical systems (RF MEMS) switches, including nonlinearly adhesive contact theory and cycle-dependent bouncing patterns. In particular, the adhesion-induced energy dissipation per cycle is modeled as a good damping parameter and included in the dynamic model of the device. This new modeling approach eliminates the time-consuming calculation connected to the complexity of the tip-drain switch contact. This model additionally accurately captures previously reported switch bouncing patterns and their time evolution. Comparing the modeling and experimental knowledge enables us to estimate the time-dependent adhesion force throughout the switch lifetime. Furthermore, a nondimensionalized model is presented to research the characteristics of a general RF MEMS switch without a priori data of its dimensions.
Did you like this research project?
To get this research project Guidelines, Training and Code... Click Here