Sell Your Projects | My Account | Careers | This email address is being protected from spambots. You need JavaScript enabled to view it. | Call: +91 9573777164

Three-Dimensional Chips Can Be Cool: Thermal Study of VeSFET-Based 3-D Chips

1 1 1 1 1 Rating 4.90 (78 Votes)

PROJECT TITLE :

Three-Dimensional Chips Can Be Cool: Thermal Study of VeSFET-Based 3-D Chips

ABSTRACT:

Thermal management becomes a huge challenge for fashionable IC designers, especially when chips go 3-D. Vertical slit field-impact transistor (VeSFET) technology provides an alternate thermal-friendly style selection. VeSFET-based mostly chips not only have a a lot of lower power density but also a better vertical thermal conductivity than their CMOS counterparts. For a VeSFET chip with ten stacked dies, the temperature increase is solely 30% of that for CMOS-primarily based chip. Assuming the same scaling trend for CMOS and VeSFET, VeSFET 3-D chips will postpone the appearance of dark silicon by 3 technology nodes compared with CMOS implementations. For VeSFET-based mostly designs, different topologies of transistor arrays could lead to different thermal behaviors. We have a tendency to perform thermal characterization of two-transistor array topologies.


Did you like this research project?

To get this research project Guidelines, Training and Code... Click Here


Three-Dimensional Chips Can Be Cool: Thermal Study of VeSFET-Based 3-D Chips - 4.9 out of 5 based on 78 votes

Project EnquiryLatest Ready Available Academic Live Projects in affordable prices

Included complete project review wise documentation with project explanation videos and Much More...