Energy-Aware Signal Integrity Analysis for High-Speed PCB Links


This paper proposes a unique approach to guage design alternatives for high-speed links on printed circuit boards. The approach combines evaluations of signal integrity and link input power. For a comprehensive analysis, different link styles are made comparable through the application of identical constraints, with the link input power as the only figure of benefit for a systematic, quantitative comparison of design alternatives. The analysis relies upon a mixture of economical physics-based mostly via and trace models, statistical time-domain simulation, and an analytical input power analysis, which allows it to handle links consisting of a giant range of channels whereas fully taking into consideration interchannel crosstalk. The proposed approach is applied to study two elementary style selections at the PCB level-single-ended versus differential signaling and signal-to-ground via ratios of 1:one versus a pair of:one-for a link consisting of 2048 vias and up to 175 striplines with an mixture information rate of one Tb/s. It is found that both style selections have a substantial impact on the desired input power of the link.

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