Nanopatterning using a simple bilayer lift-off process by transfer printing based on poly(dimethylsiloxane) templates


An economical and versatile technique for fabricating nanopatterns by a raise-off procedure is presented. The method involves an inked technique based on the poly(dimethylsiloxane) (PDMS) mould to fabricate a nanopatterned UV-curable resist because the prime-layer and poly(methyl methacrylate) (PMMA) because the underlayer. The minimal residues are left on the PMMA as a result of PDMS absorbs the organic molecules of UV-curable resist after the transferred step. High O2 reactive ion etching selectivity of the prime-layer to the underlayer is necessary to make the undercut pattern profile that's essential for the stable lift-off method. The UV-curable resist shows high etch resistance to O2 plasma and PMMA is an underlying resin to make an undercut profile that is important for the carry-off process. The etch rates of the PMMA film and UV-curable resist by O2 plasma were examined as a operate of bias voltage underneath varied oxygen conditions during the etching process. To reveal the mechanism of etch resistance, the chemical composition of UV-curable resist was analysed before and after the O2 plasma etching method by using X-ray photoelectron spectroscopy. Hence, the periodical patterns were fabricated using this bilayer raise-off process, which shows nice potential within the fabrication of micro/nanodevices and in their applications.

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