Enhancing the thermal and electrical performance of epoxy microcomposites with the addition of nanofillers


Two totally different types of microcomposites, specifically alumina and silica microcomposites, were strengthened with nanosized fillers, and their thermal and electrical properties were investigated. It was shown that the addition of small amounts of nanosized fillers (but 1 vol p.c) improves both the thermal and electrical performance of microcomposites primarily based on epoxy. The addition of vol p.c of nanosized hexagonal boron nitride to silica microcomposite will increase the thermal conductivity by 30%, the AC breakdown strength by sixty five%, and finally, the DC breakdown strength by 50percent. Important parameters that have an effect on the performance of micro-nanocomposites are the interaction between the particles and matrix and water uptake. The surface modification of the nanoparticles ends up in a smart adhesion between the particles and matrix, which offers epoxy a a lot of rigid structure. Furthermore, nanoparticles and their interfacial layers increase the interaction between the microparticles as a result of they bridge the unfilled gaps between them. On the other hand, water uptake negatively affects the electrical performance of composites, and it's been shown that water uptake positively depends on the fill grade. The quality of the production procedure is a vital issue that considerably affects the performance of composites. Composites with increased mass density have higher likelihood of including structural imperfections such as voids, that degrade both the electrical and thermal properties. Finally, the experimental results show that materials used already in industry will be improved by adding only a tiny quantity of nanofillers, reflecting the potential of nanotechnology in the sector of dielectrics.

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